The modern era of virtual reality really kicked off in earnest just over a decade ago, when the Oculus Rift promised 3D ...
Elliot Williams and Al Williams got together to share their favorite hacks of the week with you. If you listen in, you’ll ...
Browser-based tools eliminate $320,000 annual licensing barriers, making advanced composite engineering accessible to ...
Abstract: Thermomechanical stress induced by through-silicon vias (TSVs) plays an important role in the performance and reliability analysis of 2.5D/3D ICs. While the finite element method (FEM) ...
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