Apple will reportedly assemble the high-end M5 chips using 2.5D packaging. This is a chip design approach that places a processor’s compute modules atop a common base layer, or interposer. The interposer is itself a semiconductor that allows data to move between the chip’s other components.

Apple's new M5 Pro, M5 Max, and M5 Ultra chips will reportedly use server-grade SoIC packaging, with the iPhone giant to use 2.5D packaging called SoIC-mH (molding horizontal) to improve production yields and thermal performance, with separate CPU and GPU designs.

One of the key elements of Apple’s A-series and M-series chips is the System-on-a-Chip (SoC) design which tightly integrates

Apple's powerful SoC — "system on a chip" — processors have been the source of its greatness for years, bringing incredible performance and long-lasting battery life to iPhones, iPads, and Macs because they use far less power processing everything we do on a laptop.