A new technical paper titled “Die-Level Transformation of 2D Shuttle Chips into 3D-IC for Advanced Rapid Prototyping using Meta Bonding” was published by researchers at Tohoku University.

The Nature Index 2024 Research Leaders — previously known as Annual Tables — reveal the leading institutions and countries/territories in the natural and health sciences, according to their output in ...

A technical paper titled “Multi-project wafers for flexible thin-film electronics by independent foundries” was published by researchers at KU Leuven and imec. “Flexible and large-area electronics ...

Unterpremstaetten, Austria (November 30, 2011) – austriamicrosystems’ (SIX: AMS) Full Service Foundry business unit today released its further expanded fast and cost-efficient IC prototyping service, ...

MOSIS, in case you aren’t familiar with the organization, is a source of back-end IC production services, from multi-project wafers (MPWs) to small production runs. But it’s also much more. The ...

Global Silicon Photonics Wafer Foundry Market Size to Grow from US$485 Million in 2025 to US$3,737 Million by 2032 PUNE, MAHARASHTRA, INDIA, August 5, 2026 ...

Samsung Electronics' foundry division plans to open its Multi-Project Wafer, or MPW, service to its 2nm process next year, giving South Korean fabless chip designers access to one of the most advanced ...

ARLINGTON, Va. – U.S. military researchers will brief industry by webinar next month on an upcoming project to find new ways of wafer bonding thin-film crystals for sensing and communications that ...