Intel has confirmed that it’s working on a discrete graphics solution for “client PCs,” which will arrive in 2020. That, however, is far from all Intel is working on. The company laid out its ...

Intel has a new 3D technology to allow for 3D chip stacking, despite previous problems with this type of capability. Share on Facebook (opens in a new window) Share on X (opens in a new window) Share ...

Use left and right arrow keys to seek audio. Intel has revealed more details on its upcoming 3D Foveros packaging technology, which it will be using to built its next-gen Meteor Lake, Arrow Lake, and ...

Intel’s EMIB was the foundation of the Kaby Lake-G partnership with AMD. Intel’s Foveros stacked-die technology produced the upcoming Lakefield chip. Now Intel is combining EMIB and Foveros into what ...

Add Yahoo as a preferred source to see more of our stories on Google. Intel Foveros isn’t the name of a new chip, but rather a technology that will allow the chipmaker to bundle various vertical chip ...

"Hot Chips" sounds like a nice side dish, but is in fact a technological symposium held yearly in Silicon Valley. It's a place for processor vendors to talk about their latest innovations, and while ...

Intel held an Architecture Day in Los Altos yesterday, where it disclosed a number of details regarding next-generation CPU and GPU architectures and manufacturing process technologies. In addition to ...

Intel made a series of major announcements this week, unveiling a suite of new technologies to power PCs and other smart devices. On Tuesday (11 December), Intel’s Architecture Day was the backdrop ...

Use left and right arrow keys to seek audio. During Intel's Architecture Day briefing they teased a new interconnect technology, which aims to replace EMIB as their go to for linking and even stacking ...